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| Home |
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About Chipbond |
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Milestones |
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| Date |
ChipBond History Events |
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| 1997 |
1997.06.11 |
Founding of Chipbond Technology Corporation, initial capital 300Mn NTD. |
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1997.07.02 |
Acquired company registeration certificate, operation commence. |
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1997.11.01 |
Complete Gold Bumping process research and manufacturing line. |
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| 1998 |
1998.05.01 |
Expansion of fab, the second clean room. |
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1998.07.03 |
Qualify fab inspection, acquired factory registration. |
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1998.07.20 |
Solder Bumping process research complete |
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1998.10.01 |
New product and services: Flip Chip and TAB. |
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| 1999 |
1999.01.16 |
Apply to be listed and open to the public market. |
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1999.03.30 |
Capital increase by 300Mn NTD. |
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1999.04.21 |
Completed registration, listed capital 600Mn NTD. |
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1999.06.01 |
Gold Bump process certified by Philips. |
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1999.08.01 |
Gold Bump process certified by Texas Instruments, NEC and Motorola. |
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1999.09.17 |
Acquired 2,031 square meter of land from Hsin Chu Science Park, new fab contruction commence. |
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1999.11.05 |
Certified by ISO-9002 |
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| 2000 |
2000.03.31 |
Gold Bump monthly output exceed 10,000 wafers. |
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2000.04.30 |
Capital increase by 600Mn NTD, total capital 1.2Bn NTD. |
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2000.05.06 |
Increase floor space of Prosperity plant, increase bumping production capacity |
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2000.06.12 |
Acquired 9,600 square meter of land from Hsin Chu Science Park |
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2000.07.31 |
Gold Bump monthly output exceed 20,000 wafers |
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2000.09.06 |
Li-Hsin Plant complete, TCP production center. |
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| 2001 |
2001.02.21 |
Certified by Economical Department as High Tech. Industry |
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2001.07.31 |
Capital increase by 200Mn NTD, total capital 1.4Bn NTD. |
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2001.10.08 |
Pass "Gre Tai Securities Market，GTSM" audit, certified to be listed on the OTC market. |
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| 2002 |
2002.01.02 |
Registered on the OTC |
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2002.01.09 |
Acquired 8,000 squre meter of land from Hsin Chu Science Park |
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2002.01.31 |
Officially listed on the OTC for public trade. |
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| 2003 |
2003.08.14 |
Acquired Li-Hsin 5th Road plant, sold Li-Hsin 1st Road plant. |
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2003.10.16 |
ISO-9000 certified. |
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| 2004 |
2004.01.15 |
Sold Li-Hsin 1st Road plant to KYEC. |
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2004.01.19 |
Obtain long term loan from five major banks lead by Chiao Tung Bank Co. |
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2004.03.23 |
Issue first Euro Convertible Bond (ECB) totalling 900Mn NTD |
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2004.04.07 |
Sold Hsin-Chu industrial property to Powertech Technology Inc. |
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2004.12.30 |
Merge with Aptos Corporation |
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| 2005 |
2005.11.17 |
Purchased Prosperity 1st Road plant 1 from FICTA. |
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| 2006 |
2006.02.13 |
Investment into Mainland China |
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2006.04.03 |
Merge with WSE inc. |
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| 2007 |
2007.04.04 |
Issue second Euro Convertible Bond (ECB) totalling 2Bn NTD |
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2007.04.14 |
Purchased Prosperity 1st Road plant 2 from FICTA. |
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2007.12.31 |
Relocate Jin-San plant to Prosperity plant for better integration. |
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| 2009 |
2009.12.07 |
Announce to merge with International Semiconductor Technology (IST)Ltd. |
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| 2010 |
2010.11.30 |
Chipbond purchased the stock right of Chipmore Technology Corporation Limited with holding up to 64.36%. |
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| 2011 |
2011.03.02 |
Chipbond cosigned the cooperation memorandum with King Yuan Electronics Co. Ltd. |
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