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| As our customers requested, the turnkey services of LCD driver
IC package and testing will provide the service from gold/solder bumping,
testing, dicing, assembly and final testing and ship the final product COF/COG
to the destination as customer specified. |
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| Integrating through Chipbond engineering process with a
consistent quality control plan, our turnkey service can effectively shorten the
product’s process cycle time and also provide our customer the complete
technical support with the effective solution including engineering prototypes
to mass production. |
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| There are two ways of bonding Driver ICs and panels: COG (Chip
on Glass) which is the direct adhesion of chip onto the LCD panel. COF (Chip on
Film) / TCP (Tape Carrier Package) which is the adhesion of chip onto a tape via
ILB, which is then bonded onto the LCD panel. The Turnkey service of integrating
all process package technologies provides the complete COG, COF/TCP assembly
process. |
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3.1 LCD Driver IC: (LCD Panel, PDP Panel, or OLED Panel…)
3.2 CIS: CMOS image sensor
3.3 Finger Print sensor
3.4 RFID
3.5 Medical devices |
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| 4.1 COG Turnkey service |
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| 4.2 COF Turnkey service |
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5.1 Wafer Bumping-mask providing, Bumped wafer
5.2 Wafer Testing- Probe card providing and maintenance, CP testing
5.3 Wafer Grinding, Dicing
5.4 Assembling-TCP/COF tape providing and ILB.
5.5 FT testing – Probe card providing and maintenance, FT test
5.6 Packing |
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