Turnkey Service  Bumping Manufacturing  Service Gold Bumping Service   - Gold Bump Solder Bumping Service   - Solder Bump - Solder Bump with Ball mount Copper Bumping Service   - Copper Pillar with Lead Free Solder Cap   Redistribution Layer (RDL)  Service Gold(Au) RDL Thick Copper(Cu) RDL  Wafer Surface Processing  Service Back Side Metal Process Dielectric Layer Coating Process  Wafer Grinding, Dicing and Pick & Place (for COG...etc) Service  Package & Test Service Driver IC Testing Non-Driver IC Testing Driver IC Package Service(COF) Wafer Level Chip Scale Packages (Tape & Reel) Service Smart card & RFID Inlay module Assembly & final testing service  Final Inspection and Failure  Analysis Service  Certificate   Home Products & Services Dielectric Layer Coating       Coating dielectric layer materials on the FEOL completed wafer; the coating materials are included BCB or Polyimide (PI). The Dielectric layer can be used as surface protective layer for semiconductor device, or as component isolation layer between the micro circuits.       Chipbond Technology Corporation provides dielectric layer coating for 6”、8”、12” wafers       4.1 BCB Coating 4.2 PI Coating

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