Introduction |
Chip on Glass (COG) is an advanced packaging technology, where ICs (Integrated Circuits) are interconnected with glass substrates. LCD panel module factories acquire driver ICs and use flip chip technology with Anisotropic Conductive Film (ACF) as the intermediate interface. This process joins the bumps on the driver IC with the ITO endpoints on the LCD panel, primarily applied in the packaging of LCD driver ICs.
COG packaging is preferred for its low thickness and high-density footprints, meeting the demand for lightweight and thin products. Its structure allows for the thinnest packaging and achieves the smallest bump spacing and highest pin count density among various packaging methods.
The COG packaging process involves wafer grinding, cutting, and rigorous quality control inspections. After ICs are sorted onto trays, they are packaged and shipped. Chipbond has rich production experience and advanced technology in the wafer grinding, laser grooving, blade sawing, and pick-and-place processes, providing customers with diverse options for COG products.
Features |
- Wafer Size: 6"/ 8"/ 12"
- Tray Size: 2"/ 3"/ 4"
Main Application |
Application Industry Category |