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| COG is an advanced technology to adhere IC chips
onto the circuit boards. By Flip Chip technology, a gold bumped IC chip is
connected to the ITO of LCD panels with ACF as a media. When this technology is
applied to TFT-LCD panels due to the circuit board being glass, it is so-called
Chip on Glass (COG). COG would be produced by means of wafer to tray. After LCD
panel module factory acquires IC, the gold bump of the IC is jointed to the
circuit board of LCD panels with the adhesive agent. |
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| 2.1 The plain monitor (LCD Panel, PDP Panel or OLED
Panel………) driver IC package |
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| Process |
Description |
Note |
| Grinding |
The grinding process is to make the wafer thinner. The current
process is used In feed grinding process. A blue tape is adhered on the front
side of the wafer, then grind the back of the wafer with the diamond discs which
is different from CMP process for the front side of wafer. |
Applications:
Driver IC, Flash Memory, Finger Print Sensor, RFID, LED driver, Consumer IC, CSP, CMOS |
| Dicing |
Dicing is the process to saw the wafer into individual ICs. |
Applications:
Driver IC, Flash Memory, Finger Print Sensor, RFID, LED driver, Consumer IC, CSP, CMOS |
| Pick and Place |
P&P is to pick up the IC from a diced wafer onto a waffle tray. |
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| Visual Inspection |
Visually examine the picked IC for cracks and chipped ICs |
Examined under microscope |
| Packing |
Pick and pack the waffle trays as customer specified. |
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