Introduction |
WLCSP (Wafer Level Chip Scale Package)utilizes photolithography and electroplating techniques to create solder balls or copper pillars as solder bump interconnects on the wafer. Subsequently, flip chip assembly is conducted to establish electrical conductivity, and to mitigate and sustain the stress resulting from thermal expansion differences between the board and the component, thereby improving component reliability. Additionally, routing redistribution techniques are utilized to effectively optimize the spacing between solder balls and interconnects, catering to the demands of shrinking IC package sizes, high-density I/O interconnects, short interconnection wires, low noise, and high electrical performance.
Chipbond can provide various bumping technologies to support the application of WLCSP. These technologies include electroplated solder balls, evaporation, and direct adhesive bonding of solder balls. Furthermore, we offers turnkey services for WLCSP processes, encompassing electroplated bumps, ball placement, wafer-level testing (chip probing), grinding and dicing, and tape & reel packaging. With extensive experience and mature process capabilities in WLCSP, Chipbond can meet the diverse requirements of customers across different industries while complying with various quality certifications.
Features |
- Wafer Size: 6"/ 8"/ 12"
- Tape Width: 8/ 12/ 16mm
Main Application |
Application Industry Category |