Turnkey Service
 Bumping Manufacturing  Service
Gold Bumping Service
 
- Gold Bump
Solder Bumping Service
 
- Solder Bump
- Solder Bump with Ball mount
Copper Bumping Service
 
- Copper Pillar with Lead Free Solder Cap
  Redistribution Layer (RDL)  Service
Gold(Au) RDL
Thick Copper(Cu) RDL
 Wafer Surface Processing  Service
Back Side Metal Process
Dielectric Layer Coating Process
 Wafer Grinding, Dicing and Pick & Place (for COG...etc) Service
 Package & Test Service
Driver IC Testing
Non-Driver IC Testing
Driver IC Package Service(COF)
Wafer Level Chip Scale Packages (Tape & Reel) Service
Smart card & RFID Inlay module Assembly & final testing service
 Final Inspection and Failure  Analysis Service
 Certificate
 
 
Home Products & Services Smart card & RFID Inlay module Assembly & final testing service
   
 
 
Smart Card/RFID module is a kind of data storage device; it use IC packaging technology and wire bonding so that the gold bump or solder bump on the chip will connect with other different substrates flexible circuit boards (FR4 or metal frame substrate). Thus, bonding integrated circuits produced by the production module provides features of computing and accessing information. Its security is better than that of the traditional magnetic stripe card (Magnetic Card). The reader interface can be divided into contact and non-contact (contactless).

RFID tags, also known as electronic tags (RFID Tag, RFID inlay) or Smart Tag (Smart Label) is another kind of data storage device. The application principle is to use a non-contact radio frequency identification technology (Radio Frequency Identification) through the reader and the application side (Application System) to access data. RFID inlay is the use of IC packaging technology, flip through the hot (flip chip bonding) chip on the way to the gold bump and set different circuit board (Al/Cu etched antenna) out of bonding the integrated circuit manufacturing modules, provide computing and information accessing functions. The final product can be used on various applications matching the market demand; through conversion (Converting) into different forms of appearances, such as Card, Label, Token, Wristband, etc.
 
 
 
 
Smartcard/RFID module and inlay use reel to reel production process; in comparison with regular glob top production process, product specifications (dimension and thickness) can stably control, and the temperature, humidity and other characteristics of high product reliability.

The RFID inlay uses reel production, with packaging machine that can be different functions settings for a single row or multi-row packaging and testing (Go / No-go or network analyzer). It can use BEOL (Converting) needs to do a single row of picking and dicing or none-picking and dicing for a single volume multi-slice ship directly.
 
 
 
3.1 Close range applications, a single read data, such as public transport ticket, access cards, personal identification cards, phone cards, mobile phone SIM cards, stored value cards.
3.2 Long-range applications, one can read multiple data, such as logistics management, asset management, or supply chain related applications.
 
 
 
4.1 Smart Card / RFID Module
 
4.2 RFID Tag (Inlay)
 
 
 
5.1 Smartcard/RFID module manufacturing
5.2 RFID Smart Label manufacturing
5.3 Shopping service of Smartcard/RFID module tape or antenna
5.4 Products reliability tests
5.5 Product failure mode analysis
 
 
 
 
 
No.3, Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, 300, Taiwan, R.O.C. TEL : +886-3-5678788 FAX : +886-3-5638998
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