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| Chipbond's lab provides high temperature test, low temperature test, temperature cycle test, constant temperature and constant humidity test and accelerated life test. |
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removal of film and potting material through means of chemical etching. |
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Place the IC in Epoxy and wait for it to dry up; then cut through the IC to examine the cross-seciton. |
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by using high electro-microscope (up to 100,000x) to inspect and measure the IC. Also allows surface roughness, film thickness and visual inspections. |
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determine package strength |
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Using optical microscope (up to 1,000x) to inspect ICs exterior. |
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using contactless optical measurement devices to measure surface roughness, able to produce 3D image. |
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inspect the internal structure of an IC non destructively. |
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using EDX to analyze element composition. |
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electrical current and electrical voltage test on failing components. |
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| This lab provides chemical analysis and instrumental analysis for internal manufacturing unit. |
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This applies to Gold Solvent, Solder Solvent, Copper Solvent, Tin Solvent composition analysis and control. |
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This applies to non-destructive analysis, minute elemental analysis, organic composition analysis, contamination analysis and pH value analysis.
Equipments: X-RAY. XRF. SEM. EDX. AA. CVS. UV. FTIR. COD. pH apparatus |
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