Chip tray is a carrier for COG IC. There have 3 kinds of size (2''、3''、4'') for Chip tray. We provided customized of chip tray color.
Features
Design : To provided the optimal carrier cave size.
Manufacture : Full process production in a clean room environment, include injection molding, inspection and packaging.
Qualify : Perform optical measurement for chip tray dimension for quality control.
Obtained ISO 9001, QC080000 certification.
Main Application
All of the bare chip carrier package, Such us COG, WLCSP, COP package application.
Application Industry Category
For Driver IC assembly package application.
Technical services provided by Chipbond
Patent tray design.
To provided customized of chip tray design and suggestion.
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