Turnkey Service
 Bumping Manufacturing  Service
Gold Bumping Service
 
- Gold Bump
Solder Bumping Service
 
- Solder Bump
- Solder Bump with Ball mount
Copper Bumping Service
 
- Copper Pillar with Lead Free Solder Cap
  Redistribution Layer (RDL)  Service
Gold(Au) RDL
Thick Copper(Cu) RDL
 Wafer Surface Processing  Service
Back Side Metal Process
Dielectric Layer Coating Process
 Wafer Grinding, Dicing and Pick & Place (for COG...etc) Service
 Package & Test Service
Driver IC Testing
Non-Driver IC Testing
Driver IC Package Service(COF)
Wafer Level Chip Scale Packaging Service
 Final Inspection and Failure  Analysis Service
 Chip Tray Design & Manufacturing Service
 Certificate
 
Home Service Certificate
   
統包服務
 
Chipbond ISO9001 Chipbond ISO14001 Sony GP certification
     
Chipbond OHSAS18001 Chipbond QC080000

Chipbond QC080000
LI-HSIN FACTORY

     
Chipbond QC080000
PROSPERITY FACTORY
Chipbond QC080000
R&D FACTORY
Chipbond QC080000
KAOHSIUNG BRANCH
     
Chipbond TOSHMS Chipbond TOSHMS
LI-HSIN FACTORY
Chipbond TOSHMS
PROSPERITY FACTORY
     
Chipbond TOSHMS
R&D FACTORY
Chipbond TOSHMS
KAOHSIUNG BRANCH
Chipbond TS16949 Bump
     
 
Chipbond TS16949 CP_COG Chipbond TS16949
KAOHSIUNG BRANCH
 
 
 
 
No.3, Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, 300, Taiwan, R.O.C. TEL : +886-3-5678788 FAX : +886-3-5638998
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