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Turnkey Service
Bumping Manufacturing Service
 
Gold Bumping Service
 
- Gold Bump
Solder Bumping Service
 
- Solder Bump
- Solder Bump with Ball mount
Copper Bumping Service
 
- Copper Pillar with Lead Free Solder Cap
Redistribution Layer (RDL) Service
 
Gold(Au) RDL
Thick Copper(Cu) RDL
Wafer Surface Processing Service
 
Back Side Metal Process
Dielectric Layer Coating Process
Wafer Grinding, Dicing and Pick & Place (for COG...etc) Service
Package & Test Service
 
Driver IC Testing
Non-Driver IC Testing
Driver IC Package Service(COF)
Wafer Level Chip Scale Packages (Tape & Reel) Service
Smart card & RFID Inlay module Assembly & final testing service
Final Inspection and Failure Analysis Service
Certificate
Management Team
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No.3, Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, 300, Taiwan, R.O.C. TEL : +886-3-5678788 FAX : +886-3-5638998
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