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Service
Turnkey Service
Bumping Manufacturing Service
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Gold Bumping Service
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Gold Bump
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Solder Bumping Service
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Solder Bump
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Solder Bump with Ball mount
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Copper Bumping Service
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Copper Pillar with Lead Free Solder Cap
Redistribution Layer (RDL) Service
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Gold(Au) RDL
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Thick Copper(Cu) RDL
Wafer Surface Processing Service
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Back Side Metal Process
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Dielectric Layer Coating Process
Wafer Grinding, Dicing and Pick & Place (for COG...etc) Service
Package & Test Service
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Driver IC Testing
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Non-Driver IC Testing
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Driver IC Package Service(COF)
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Wafer Level Chip Scale Packages (Tape & Reel) Service
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Smart card & RFID Inlay module Assembly & final testing service
Final Inspection and Failure Analysis Service
Certificate
Management Team
Financial Information
Chipbond Location
Chipbond Communication
Chipbond Web Mail
No.3, Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, 300, Taiwan, R.O.C. TEL : +886-3-5678788 FAX : +886-3-5638998
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