GaAs can be utilized as a semiconductor material due to its high electron mobility, low dielectric constant, ability to incorporate deep-level impurities, low electron effective mass, and unique band structure suitable for epitaxial growth.
GaAs exhibits excellent characteristics, including high frequency, low noise, high efficiency, and low power consumption.
As a semi-insulating material, GaAs allows for reduced losses in the matching network required for designing power amplifiers on GaAs chips. It also influences the achievable output power and operational efficiency.
The applications of GaAs extend beyond the field of communication. With its ability to emit and absorb light, GaAs plays a vital role in various technologies, including facial recognition systems, as well as emerging domains like AR/VR and autonomous vehicles.
Given the brittle and hard nature of GaAs, special attention is required during transportation, handling, grinding, and dicing processes to prevent breakage. Over the years, our company has developed expertise in these areas, resulting in high chip yields for GaAs wafer production.
Main Application
Power amplifiers
Optoelectronic components
High-frequency communication components
Wireless Local Area Network (WLAN)
Fiber optic communication
Satellite communication and microwave communication
Technical services provided by Chipbond
Wafer size: Majority 6-inch
Foundry Technology: HBT, PHEMT, BIHEMT
Manufacturing Techniques: Cu Pillar, Solder, Ball Placement, etc., for bumping processes, DC testing, RF testing, wafer thinning, and dicing.
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