Different from silicon wafers, there are special substrates used in various applications. These include piezoelectric materials such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and silicon dioxide (SiO2), as well as glass substrates and sapphire substrates used for LEDs.
Piezoelectric materials, such as LiTaO3, LiNbO3, and SiO2, possess an asymmetrical atomic arrangement that lacks a center of symmetry. When these materials are subjected to pressure, they undergo deformations that lead to the appearance of positive and negative charges on their surfaces. These unique properties make them well-suited for various RF applications, including surface acoustic wave (SAW), bulk acoustic wave (BAW), and film bulk acoustic resonator (FBAR) filters.
Glass substrates are also utilized in the production of microelectromechanical systems (MEMS). These substrates, including borosilicate glass, are specially designed to be ultra-thin and possess desirable properties suitable for MEMS applications.
Sapphire substrates play a crucial role in LED manufacturing, particularly in the production of gallium nitride (GaN) epitaxial layers for blue light-emitting diodes (LEDs). Sapphire substrates are cut from sapphire boules, which are single-crystal structures based on aluminum oxide (Al2O3). The growth of sapphire boules is achieved through the method of crystal pulling, where the parameters may vary among manufacturers, resulting in different levels of purity.
Main Application
BAW Filter & SAW Fliter
LED
Medical
Technical services provided by Chipbond
Wafer Size: Majority 6-inch.
Foundry Technology: HBT, PHEMT,BIHEMT.
Manufacturing Techniques: Cu Pillar Bump, Solder Bump, Ball Placement, etc., for bumping processes.
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