Introduction |
DPS (Die Processing Service) includes wafer grinding/thinning,Dicing, and tape-and-reel processes. Our wafer grinding/thinning service is performed using an in-line grinding system, which allows for wafer thinning or ultra-thin wafer requirements. Wafer Dicing can utilizing laser scribing or traditional blade dicing methods, and is capable of processing Low-k wafers. Our services also include laser marking, AOI (Automated Optical Inspection), and tape-and-reel packaging. In addition, we offer optional processes such as Back Side Metal (BSM) and Backside Lamination (black), providing a complete solution tailored to our customers' needs.
Features |