Introduction |
Packaging attachment process is applied to products facing high temperature or insufficient strength. It involves adding protective materials to COF products to enhance assembly strength. In response to customer's mass production needs, Chipbond has developed automated attachment equipment to supply various types of attachment materials. Chipbond is a pioneering manufacturer in COF packaging attachment with extensive production experience and advanced technology. The process capabilities have been rigorously validated by customers, allowing Chipbond to offer turnkey services from material design, production, to verification. Currently, Chipbond provides various attachment materials, including heat sinks/ stiffeners/ EMI/ ESD materials. The heat sink and stiffeners come in multiple material structures, which can be tailored to meet customer requirements and complete customer certifications.
Features |
- Heat sinks/ Stiffeners/ EMI/ ESD materials.
Main Application |
Application Industry Category |