Introduction |
FSM (Front Side Metallization) is the process that sputter metal on wafer surface by physical deposition, and then do photolithography and etching according to cusomer-designed mask.The commonly used packaging methods in conjunction with FSM are as follows:
Chipbond has extensive experience in sputtering, photolithography and etch processes, ensuring the quality demanded by our customers. We also offer Turnkey service, including Back Side Metallization (BSM), wafer level probing, dicing, die sorting, WLCSP and etc..., fulfilling customers' need regarding the process after FSM.
Features |
Main Application |
Application Industry Category |