Introduction |
Chip-on-Plastic (COP) also known as Plastic Flip Chip Package, is an advanced packaging technology that connects ICs with plastic flexible substrates. In display module factories, after obtaining driver ICs, COP uses flip chip technology with Anisotropic Conductive Film (ACF) as the intermediate interface to bond the bumps on the driver IC with the ITO endpoints on the panel module. It is primarily used in the packaging of driver ICs for Flexible Organic Light-Emitting Display (OLED) screens.
Due to the development of packaging technology for high-end smartphones' display panels, which require low thickness, high pin count density, and extremely narrow frames, the COP packaging structure using plastic flexible substrates minimizes the display's frame maximizing the viewing area. Similar to COG packaging, COP achieves the goals of smallest bump pitch and highest pin count density.
The COP process involves electroplating gold bumps on the wafer, followed by grinding, cutting, and rigorous quality control inspections. After sorting the ICs onto trays, they are packaged and shipped. Chipbond has rich production experience and advanced technology in processes like wafer grinding, laser grooving, blade cutting, and pick-and-place, offering customers various options for COP products.
Features |
- Wafer Size: 6"/ 8"/ 12"
- Tray Size: 2"/ 3"/ 4"
Furthermore, considering the difference in rigidity between the hard IC and the soft substrate, the arrangement of bumps is often designed in a fan-shaped pattern to match the thermal expansion coefficient and the compatibility of the soft and hard bonding.
Main Application |
Application Industry Category |