Turnkey Service
 Bumping Manufacturing  Service
Gold Bumping Service
 
- Gold Bump
Solder Bumping Service
 
- Solder Bump
- Solder Bump with Ball mount
Copper Bumping Service
 
- Copper Pillar with Lead Free Solder Cap
  Redistribution Layer (RDL)  Service
Gold(Au) RDL
Thick Copper(Cu) RDL
 Wafer Surface Processing  Service
Back Side Metal Process
Dielectric Layer Coating Process
 Wafer Grinding, Dicing and Pick & Place (for COG...etc) Service
 Package & Test Service
Driver IC Testing
Non-Driver IC Testing
Driver IC Package Service(COF)
Wafer Level Chip Scale Packaging Service
Smart Card IC Chip Module & RFID Tag service
 Final Inspection and Failure  Analysis Service
 Chip Tray Design & Manufacturing Service
 Certificate
 
Home Products & Services
   
統包服務
 
 
 
 
 
 
 
No.3, Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, 300, Taiwan, R.O.C. TEL : +886-3-5678788 FAX : +886-3-5638998
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