Processing Services

Testing in semiconductor uses the Automatic Test Equipment to detect out the defective products. There are two types of testing as:Chip Probing (CP) and Final Test (FT).

• Chip Probe (CP)

CP is taken to detect out the defects against the design electrical specification at a wafer level and also so-called wafer sorting.Usually functions are not tested at this stage.

• Final Test (FT)

FT is taken to test before shipping of the final product to the customer. This test includes electrical test and functional test. This process is also known as product testing.

With extensive and excellent testing experience, we provide professional and complete panel driver IC test service, including NPI test evaluation, CP & FT test services, Die test service and Test Map integration service.

• Finding out potential risks and proposing solutions with customer's product during NPI test evaluation.
• Customized new product CP & FT test program development and probe card design provided by our professional test team.
• Professional technology, the most efficient experiment execution and high-quality engineering services.
• Providing test program conversion with different test platform to meet customer capacity demand.

• With internal advanced Test Map system, monitoring complete test yield and visual inspection to meet customer specification.
• Offering mass-production/engineering experimental evaluation and integrated Turnkey information.
• Automatic integrated test system for ensuring premium test quality.

• Prober wafer size : 6~12 inch
• Handler tape size : 35、48、70 mm
• Prober test temperature : -50~150℃
• Handler test temperature : -40~125℃
• Probe card type : Cantilever、Vertical
• Automotive related test service

• CP/FT LCD Driver test
• MOS-FET test
• Micro LED test
• Inkless map integration
• Test program development
• Auto-transmit customized report
• Auto-transmit WIP data
• Testing data preservation and backup
• Remote connection service
• Automated system