Chipbond
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Investors

Financial Reports

  • Financials
    • Monthly Revenues
    • Financial Reports
  • Corporate Governance
    • Board of Directors
    • Committees
    • Corporate Governance Officer
    • Major Corporate Policies
    • Ethical Management
    • Risk Management
    • IP Management
    • Internal Audit
  • Shareholders Service
    • Shareholders’ Meeting
    • Major Shareholders
    • Dividends
    • Stock Quote
    • Historical Stock Prices
    • Material Information
  • Investor Conference
    • Investor Conference
Financial Reports

Financial reports

Fiscal year Q1 Q2 Q3 Q4 Individual
2025
2024
2023
Inquiry for historical financial reports
Fiscal year Q1 Q2 Q3 Q4 Individual
2022
  • About
    • About Chipbond
    • Mission and Culture
    • Milestones
    • Organization & Management Team
    • Locations
    • Contact Us
    • Chipbond Policy
    • Certifications
  • Products & Services
    • Overview
    • Processing Services
    • Compound Semiconductor
    • Product Introduction
  • Investors
    • Financials
    • Corporate Governance
    • Shareholders Service
    • Investor Conference
  • Careers
    • Join Chipbond
    • Chipbond Life
    • Learning and Development
  • ESG
    • Overview
    • Sustainability Approach
    • Corporate Governance
    • Sustainable Environment
    • Fulfilling Workplace
    • Supply Chain Management
    • Social Participation
    • Download and Interact
  • Events
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Chipbond
No.3 Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, 300, Taiwan, R.O.C.
+886-3-5678788
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