Chipbond
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IP Management

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IP Management

The Company continues to invest in technological research and development aligned with its operational objectives, and has established an intellectual property management strategy accordingly. Employees are actively encouraged to innovate and conduct independent research to enhance product innovation and R&D capabilities, as well as to pursue patent applications. Through strengthening the management and utilization of intellectual property, and effectively managing patents, trademarks, and trade secrets, the Company further supports the development of its innovation capacity and overall competitiveness.

 

  1. Patents Management: Established "Intellectual Property Management Measures" to incentivize employees to submit patent proposals. A patent application review system was created to control application quality through internal case review procedures.
  2. Trademarks Management: Optimized trademark maintenance necessity through global brand layout planning.
  3. Trade Secrets Management: Formulated rigorous confidentiality policies through information security systems, contract management systems, confidentiality agreements integrated with human resources management, and enhanced employee training.

 

The execution results of intellectual property management

  1. Published monthly patent reports to update business groups on development direction and progress.
  2. Cumulative approved invention, utility model, and design patents reached 432, with 137 under review as of the end of 2025.
  3. Conducted "IP Law and Procedures" and "Confidential Information Protection" courses. In 2025, participation reached 2,060 individuals, totaling 1,349 man-hours.
  4. The Company reports IP Management Plan implementation to the Board annually. Most recent report date was February 26, 2026.
  • About
    • About Chipbond
    • Mission and Culture
    • Milestones
    • Organization & Management Team
    • Locations
    • Contact Us
    • Chipbond Policy
    • Certifications
  • Products & Services
    • Overview
    • Processing Services
    • Compound Semiconductor
    • Product Introduction
  • Investors
    • Financials
    • Corporate Governance
    • Shareholders Service
    • Investor Conference
  • Careers
    • Join Chipbond
    • Chipbond Life
    • Learning and Development
  • ESG
    • Overview
    • Sustainability Approach
    • Corporate Governance
    • Sustainable Environment
    • Fulfilling Workplace
    • Supply Chain Management
    • Social Participation
    • Download and Interact
  • Events
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Chipbond
No.3 Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, 300, Taiwan, R.O.C.
+886-3-5678788
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