Now - 2020
2019 - 2010
2009 - 2000
1999 - 1997
2024
  • Apr. Outstanding corporation for exceeding employment of people with disabilities.(Hsinchu City)
  • Jun. The 10th "Corporate Governance Evaluation"-Top 5% OTC Company.
  • Nov. The Board approved the investment plan of Malaysia subsidiary.
  • Nov. OTC Leading Governance Award.
  • Nov. The Kuangfu Plant was ranked as an “excellent bonded factory” by the Customs Administration, MOF.
  • Dec. Green Procurement Outstanding Corporation. (Hsinchu City)
  • Dec. Employee Health Promotion Plan-Outstanding Group.(Kaohsiung City)
2023
  • Jun. Ranked in top 5% of “The 9th Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
  • Dec. Kuangfu Plant completes the verfication of the ISO 50001 energy management system.
2022
  • May. Ranked in top 5% of “The 8th Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
  • Jun. Obtained third-party verification for the initial Chipbond Sustainability Report.
  • Aug. Successfully completes the first ISO 14064-1 greenhouse gas inventory third-party verification.
  • Oct. The Kuangfu Plant was ranked as an “excellent bonded factory” by the Customs Administration, MOF.
  • Dec. Certified with ISO 27001 Information Security Management System.
2021
  • Jun. Ranked in top 5% of “The 7th Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
  • Sep. Announced to engage in strategic alliance with United Microelectronics Corp.
  • Oct. The Kuangfu Plant was ranked as an “excellent bonded factory” by the Customs Administration, MOF.
  • Nov. Kuangfu Plant II inauguration and commencement.
2020
  • Jan. Built Kuangfu Plant Ⅱ by the contractor on self-owned land.
  • May. Ranked in top 5% of “The 6th Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
  • Sep. “International Trade Award”-The Best Trade Contribution Award,by Bureau of Foreign Trade, MOEA.
  • Oct. The Kuangfu Plant was ranked as an “excellent bonded factory” by the Customs Administration, MOF.
  • Oct. Announced to engage in strategic alliance with Orient Semiconductor Electronics, Ltd.
2019
  • May. Ranked in top 5% of “The 5th Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
2018
  • May. Ranked in top 5% of “The 4th Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
  • Jul. Completed indirect disposal of 43.0767% shares of Chipmore Technology Corp. Ltd.
  • Sep. Invested in Hefei Chipmore Materials Technology Co. Ltd.
2017
  • May. Ranked in top 5% of “The 3rd Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
  • Dec. Announced to indirectly dispose 43.0767% shares of Chipmore Technology Corp. Ltd.
  • Dec. Announced to indirectly invest in China with strategic investors to establish a tape company through the third-places investee.
2016
  • Jun. Ranked in top 5% of “The 2nd Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
2015
  • May. Acquired Cando’s plant located at Kuangfu Road, Hsinchu Industrial Park.
  • Jun. Ranked in top 5% of “The 1st Corporate Governance Evaluation” TPEx-listed companies, by Financial Supervisory Commission, FSC.
2014
  • May. Announced to simplified merger with 100% owned subsidiary, SIMPAL.
2013
  • Oct. Acquired 100% shares of SIMPAL Electronics Corporation Limited by share swap.
2011
  • Nov. Received the "National TrainQuali Prize" awarded by the Vocational Training Bureau.
  • Nov. Received the TTQS Gold Medal for Corporate Organizations, by Vocational Training Bureau.
2010
  • Nov. Investment Committee approved the acquisition of shares of Chipmore Technology Corp. Ltd. shares
2009
  • Dec. Announced to merge with International Semiconductor Technology (IST) Ltd.
2008
  • Oct. Received the 6th "Golden Wingspan Award "presented by the Ministry of Labor.
2007
  • Apr. Issued convertible bond of NT$2 billion for the second time.
  • Dec. Integrated production process by transferring the equipment from Jinshan Plant to Zhanye 1st Road plant
2006
  • Feb. Invested in Mainland China through the third-places.
  • Apr. Announced to merge with WSE Inc.
2005
  • Nov. Purchased Zhanye 1st Road plant 1 from FICTA.
2004
  • Mar. Issued convertible bond of NT$900 million.
  • Dec. Announced to merge with Aptos Corporation.
2003
  • Aug. Acquired Lising 5th Road plant.
2002
  • Jun. Listed on the OTC for public trade. Stock Code is 6147.
2001
  • Jul. Cash injection of NT$200 million. Paid-in Capital of NT$ 1.4 billion.
2000
  • Apr. Cash injection of NT$600 million. Paid-in Capital of NT$ 1.2 billion.
1999
  • Apr. Registration of alteration completed. Paid-in Capital of NT$600 million.
1998
  • Jul. Solder Bump products developed.
  • Oct. Increase business item: Flip chip, TAB.
1997
  • Jun. Chipbond Technology Corporation Founded. Initial capital NT$300 million.
  • Jul. Acquired the certificate of incorporation by Ministry of Economic Affairs.
  • Nov. Gold Bump products developed. Production line completed.