Chipbond
  • About
    About
    About
    • About Chipbond
    • Mission and Culture
    • Milestones
    • Organization & Management Team
    • Locations
    • Contact Us
    • Chipbond Policy
    • Certifications
  • Products & Services
    Products & Services
    Products & Services
    • Overview
    • Processing Services
      • Bumping Services
      • BSM / FSM Services
      • Test Services
      • Package Services
      • DPS Services
    • Compound Semiconductor
      • SiGe Wafer
      • GaAs Wafer
      • GaN Wafer
      • SiC Wafer
      • Others
    • Product Introduction
      • Flexible Tape-and-Reel Circuit Substrate (High-end FPC)
      • Chip Tray
  • Investors
    Investors
    Investors
    • Financials
      • Monthly Revenues
      • Financial Reports
    • Corporate Governance
      • Board of Directors
      • Committees
      • Corporate Governance Officer
      • Major Corporate Policies
      • Ethical Management
      • Risk Management
      • IP Management
      • Internal Audit
    • Shareholders Service
      • Shareholders’ Meeting
      • Major Shareholders
      • Dividends
      • Stock Quote
      • Historical Stock Prices
      • Material Information
    • Investor Conference
      • Investor Conference
  • Careers
    Careers
    Careers
    • Join Chipbond
      • Job Vacancies
      • Applicant Guidance
      • Traffic Information
      • Q&A
      • Activities Zone
    • Chipbond Life
      • Compensation and Benefits
      • Workplace
      • Work and Life
    • Learning and Development
      • Education and Training
      • Career Development
  • ESG
    ESG
    ESG
    • Overview
    • Sustainability Approach
      • Message from the Chairman
      • ESG Policy and Organization
      • Stakeholders Engagement
      • ESG Strategies and Goals
      • Verification and Recognition
    • Corporate Governance
      • Board of Directors
      • Committees
      • Corporate Governance Officer
      • Ethical Management
      • Risk Management
      • Internal Audit
    • Sustainable Environment
      • Climate & Carbon Management
      • Water Resource Management
      • Waste Management
      • Air Pollution Management
    • Fulfilling Workplace
      • Employee Welfare
      • Talent Development
      • Respect Human Rights
      • Health and Safety
    • Supply Chain Management
      • Supplier Management
      • Hazardous Substance Management
      • Conflict Minerals Management
    • Social Participation
      • Education and Culture
      • Environmental Actions
      • Social Care
    • Download and Interact
      • Sustainability Report Download
      • Sustainability Topics Concern Survey
  • Events
English
Language
  • English
  • 繁體中文
  • English
    • English
    • 繁體中文
Investors

Monthly Revenues

  • Financials
    • Monthly Revenues
    • Financial Reports
  • Corporate Governance
    • Board of Directors
    • Committees
    • Corporate Governance Officer
    • Major Corporate Policies
    • Ethical Management
    • Risk Management
    • IP Management
    • Internal Audit
  • Shareholders Service
    • Shareholders’ Meeting
    • Major Shareholders
    • Dividends
    • Stock Quote
    • Historical Stock Prices
    • Material Information
  • Investor Conference
    • Investor Conference
Monthly Revenues

The latest three years monthly revenue

Unit: NT$ in thousands
Month 2025 2024 2023
01 1,644,773 1,435,790 1,431,088
02 1,672,234 1,321,565 1,403,800
03 1,825,530 1,527,016 1,768,124
04 1,760,321 1,610,551 1,694,281
05 1,811,946 1,753,738 1,901,312
06 1,788,057 1,875,143
07 1,901,721 1,735,030
08 1,858,827 1,747,132
09 1,788,447 1,696,980
10 1,876,835 1,693,370
11 1,722,069 1,598,569
12 1,752,950 1,511,559
Full year 8,714,804 20,337,566 20,056,388
  • About
    • About Chipbond
    • Mission and Culture
    • Milestones
    • Organization & Management Team
    • Locations
    • Contact Us
    • Chipbond Policy
    • Certifications
  • Products & Services
    • Overview
    • Processing Services
    • Compound Semiconductor
    • Product Introduction
  • Investors
    • Financials
    • Corporate Governance
    • Shareholders Service
    • Investor Conference
  • Careers
    • Join Chipbond
    • Chipbond Life
    • Learning and Development
  • ESG
    • Overview
    • Sustainability Approach
    • Corporate Governance
    • Sustainable Environment
    • Fulfilling Workplace
    • Supply Chain Management
    • Social Participation
    • Download and Interact
  • Events
Privacy Policy Sitemap
Copyright ©2025. CHIPBOND Technology Corporation. All rights reserved.
Chipbond
No.3 Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, 300, Taiwan, R.O.C.
+886-3-5678788
We have placed cookies on your device to make our website better. If you continue using our website, we assume you agree to it. You can learn more details here.
OK