Hazardous Substance Management |
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Through the Hazardous Substance Process Management System (IECQ-QC 080000), Chipbond is able to ensure that the wafer to be processed and the back-end packaging and testing products are complied with the international hazardous substance regulations and satisfies customers’ requirements for the hazardous substance management. To protect the natural environment and the health and safety of product users, we implement the following management actions:
1. Establish a Hazardous Substance Control List as Per the International Regulations and Customer Requirements |
Chipbond establishes the hazardous substance control list according to the international hazardous substance regulations and the requirements of main customers, and updates and expends the scope of the list based on the international regulations year by year.
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2. Establishing a Procurement Process for Raw Materials Free of Harmful Substances |
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3. Hazardous Substance Compliance Management of Product and Packaging |
The packaging materials used for the Chipbond’s products for shipment, including papers and plastics, are recyclable and contain less than 100 ppm of lead, cadmium, mercury, and hexavalent chromium, which is conformed to the EU regulation. In addition, we also do not use PVC, which is generally forbidden, in the plastic packaging material. To ensure the hazardous substance compliance of materials and production, in addition to the source management of materials, equipment and fixtures used by the company, we commission independent testing organizations to test the sample products produced by each production every year, so as to make sure whether the products are conformed to the requirements of customers and regulations. In 2023, Chipbond tested 41 types of product portfolios, and all testing results satisfied the control requirements of RoHS regulation. |