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Introduction |
| The COF (Chip-on-Film) manufacturing process is a technology of bonding the IC gold bumps to the inner lead of the flexible substrate through thermocompression to achieve the electrical connection between the IC and the flexible substrate circuits. At this time, the bonding strength between the leads and the bumps is weak, and can be easily affected by external force causing the leads to break. |  |
Therefore, there must be appropriate structural protection, so an adhesive material is used to fill the gap between the tape and the IC. After baking and hardening, the low moisture-absorbing properties of the electrical insulating adhesive block external moisture and pollutants, and coats the inner leads to avoid structural damage, thereby improving reliability and mechanical strength.
Chipbond has rich production experience and advanced technology in COF packaging. Moreover, it has never ceased to develop new technologies, such as Super Fine Pitch products, double-sided copper products, and special heat dissipation (Surface Mount or Adhesive Material) products, as well as other protective film attachment products, all of which have been mass-produced.
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Features |
- Wafer Size: 6"/ 8"/ 12"
- Tape Width: 35/ 48/ 70mm
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Main Application |
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Application Industry Category |