Processing Services

BSM (Back Side Metallization) is a process where metal is deposited on the backside of a wafer after thinning through grinding. This physical deposition of metal provides thermal conduction for heat dissipation and reduces impedance in components.  Meanwhile, metal can be the adhesive layer between frame and substract. (e.g. Die attach, Wire bonding)

Chipbond prouduces thin wafers on 8 inch of wafer size and 75um of thinnest thickness. We can handle wafer warpage up to 25mm and offer special physical process improvements to reduce warpage by 30-60%. We provide nine different BSM metal layer combinations for various applications. We also offer customized options for different metal layer structures based on customer packaging requirements.

Chipbond also offer Turnkey service inculding Au bonding, solder, RDL, wafer level probing, dicing, die sorting, WLCSP which satisfy the demand of BSM, package/assembly and testing from customer.

• Ability on different wafer substracts: Si, SOI, GaN, SiGe.
• Diverse metal options: TiNiAg, TiNiAgSn, TiNiAgAu, TiNiAu, TiNiAuSn, TiCu, TiAl, etc.
• High warpage product treatment.
• Increase metal connection ability by etching.
• Shrink IC package volume.
• Reduce wafer warpage level at 30~60% by physical process.

• Discrete Power Devices
• MOSFETs
• Diodes
• TSV
• Schottky Devices
• Power supply
• Swith controller
• LED
• Logic

• Consumer Electronics
• Communication (4G, 5G)
• Industrial
• Automotive