Processing Services

The service of Redistribution Layer (RDL) involves utilizing thin film, photolithography, and electroplating techniques to create an additional wiring layer on the surface of the wafer. This layer is used to modify and increase the positions of the original IC's interconnect points (I/O pads) in order to achieve route redistribution. Chipbond currently offers RDL services with PI (polyimide) and metal multilayer stacking for fan-in and fan-out packaging configurations.

3P2M

4P4M

•  Redistribution layer：

- To increase the spacing between the I/Os of the chip, making it easier to implement bumping or ball placement processes.

- It can serve as a stress-buffering layer, reducing the stress after WLCSP assembly.
- It serves as a replacement for certain sections of the IC circuit design.

• Can be subjected to various simulations to optimize circuit design, including：
  - Electrical simulation
  - Thermal simulation
  - Stress simulation
  - Mold flow simulation

• Fan-in WLCSP
• Fan-out WLCSP
• 2.5D/3D integrated package
• Power management IC
• Pressure sensing component
• High-speed synchronous dynamic random-access memory (DDR SDRAM) component
• RF components (RF power amplifier/RF low noise amplifier/RF transceiver)