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Introduction |
| Gold Bump |
The process of creating gold bumps involves using thin film, photolithography, and electroplating techniques to fabricate gold bumps on the chip's solder pads. Subsequently, heat and pressure are applied to bond the bumps with the solder interface for packaging purposes (assembly).
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| Cu/Ni/Au Bump |
The process for creating Cu/Ni/Au bumps is similar to that of gold bumps. Initially, an under bump metallization (UBM) layer is sputtered onto the chip, followed by photolithography and electroplating processes to produce Cu/Ni/Au bumps on the IC's signal input/output interfaces or solder pads.
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Features |
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Main Application |