|
Introduction |
| Solder bumping process (Lead free solder/ tin-lead solder) |
The wafer solder bump process produces the solder bump on the assembly connection pads. Then it is going to reflow to assembly with the substrate. Chipbond currently offers various solder bump technologies for mass production, including electroplating, solder paste transfer, evaporation, and solder ball direct attachment.
When WLCSP chooses larger tin-lead balls to form joints to achieve the purpose of conduction. The purpose is to increase the gaps between the components and substrate board and then to reduce and sustain the stress from the variation of heat expansion between board and component in order to enhance the component reliability. Chipbond provides different bumping technologies to support WLCSP applications, including electroplating, evaporation, and solder ball direct attachment. |
 |
 |
|
Features |
|
|
Main Application |
|