Welcome to Chipbond

Founded in July 1997, Chipbond is a leading packaging and testing service provider with various solutions of bump, test, and assembly for ICs. Chipbond is also a major OSAT for display driver ICs among world.


Chipbond has been recognized in the "9th Corporate Governance Evaluation" as one of the top 5% companies.
Chipbond ranked first as the “Energy-saving Excellence Company” in Hsinchu Science Park for the Lihsin Plant.
Chipbond's inclusion in the OTC Sustainable Index as a component stock has been confirmed.

Exploring Chipbond

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