We drive the future

Creating a community of shared future filled with both a sense of accomplishment and happiness.

Founded in July 1997, Chipbond is a leading packaging and testing service provider with various solutions of bump, test, and assembly for ICs. Chipbond is also a major OSAT for display driver ICs among world.

Bumping Services

Test Services

Package Services

Compound Semiconductor

High-end FPC

Chip Tray

2025/06/23

Chipbond Ranks Top 5% in Governance for 11th Year

2024/11/04

Chipbond recognized with "OTC Leading Governance Award".

2024/06/20

Chipbond has been recognized in the "10th Corporate Governance Evaluation" as one of the top 5% companies.

Sustainability

How do we build a sustainable future for the next generation?

Careers

Join us, drive up your future.

Investors

Offering corporate governance and financial information.

If you have any question, please contact us.